| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for treating many substrates which increases the throughput, without increasing the foot print of the apparatus. SOLUTION: A dual wafer treating apparatus 4 includes a chamber housing 14 having upper, lower and center sections 18, 20, 16 by demarcating the interior. An electrostatic chuck 34 has electrostatic chuck planes 38, 40 at opposed sides and is turnably mounted in the housing 14 so that the planes 38, 40 may face the upper and lower sides of the housing 14. After a wafer 36 is positioned on the chuck planes, the electrostatic force is used to keep the wafer fixed to the chuck planes. The chuck is turned 180 deg. to make a second wafer settable on a second chuck plane, thus treating the two wafers at once. The chuck planes may be replaced with mechanical clamps. |
