| 摘要 |
A surface mount semiconductor package employs locking barbs 73,74 formed in a metal pad of a lead frame for locking a plastic housing 30 to the metal pad on which a semiconductor device is mounted. The lead frame includes terminals 32-36 having elongated crushable beads 100, 101 on their side surfaces adjacent the portions of the terminals 32-36 just outside the plastic housing 30. The beads 100, 101 are crushed inwardly by a molding tool when it closes to provide a seal which prevents the molding plastic from bleeding out and over the sides of the terminals 32-36 which extend beyond the housing 30 and which could interfere with solder connection to the terminals. |
