| 发明名称 |
Electroless gold plating bath |
| 摘要 |
To an electroless gold plating bath comprising a water-soluble gold compound, a complexing agent, and a reducing agent is added a small amount of polyvinyl pyrrodidone. The bath allows a satisfactory gold plating film to be formed on metal portions on a non-conductive substrate without plating spread.
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| 申请公布号 |
US5803957(A) |
申请公布日期 |
1998.09.08 |
| 申请号 |
US19970782564 |
申请日期 |
1997.01.10 |
| 申请人 |
C. UYEMURA & CO.,LTD. |
发明人 |
MURAKAMI, TOORU;MORIMOTO, KEIZIN;YANADA, ISAMU;TSUJIMOTO, MASANOBU |
| 分类号 |
C23C18/44;(IPC1-7):B22F7/00 |
主分类号 |
C23C18/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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