| 摘要 |
Light-receiving devices 2 are two-dimensionally arranged on a substrate 1, bonding pads 4 electrically connected to the light-receiving devices 2 in the respective rows or columns via signal lines 3 are arranged on the outer periphery of the substrate 1, and a protective passivation film 5 is disposed on the light-receiving devices 2 and signal lines 3, thereby forming a light-receiving device array 6. On the light-receiving surface of the light-receiving device array 6, a scintillator 7 made of columnar crystals of CsI is deposited. On the other hand, a resin frame 8 formed like an elongated frame is disposed inside the bonding pads 4. Inside this frame, a protective film 12 in which an inorganic film 10 is held between organic films 9, 11 made of Parylene is laminated. The outer periphery of the protective film 12 is in close contact with the resin frame 8 with the aid of the coating resin 13. |
