| 摘要 |
PROBLEM TO BE SOLVED: To obtain a material having low coefficient of thermal expansion [(5 to 10)×10<-6> /K] coping with an alumina type package material and also having high thermal conductivity (<=100W/mK) exceeding that of a metallic material, such as Fe and Ni. SOLUTION: A powder mixture, having a composition consisting of, by weight, <=78% SiC, 13-49% Al, and Si and X (where X means one or >=2 kinds among Li, B, Na, Mg, Ca, Ti, Sr, Zr, Ba, Y, Th, and rare earth elements) in the amounts satisfying inequality (54/46)wt.%<=Al/(Si+X)<=(88/12)wt.% (where X=0 to 3wt.% is satisfied), is sintered. An SiC powder, previously subjected to high temp. vacuum reduction at <=1400 deg.C, can be used. Further, acid pickling treatment with an HF solution can be applied to an SiC powder before blending or an SiC-Al-Si-X powder mixture after blending. |
