发明名称 |
Distributed transmission line structure |
摘要 |
A distributed transmission line structure (10) includes a ground plane (26) affixed to a substrate (12). The substrate (12) is formed of a generally nonconductive material. A first metallic strip (14) is affixed to the substrate (12) and is electrically connected to the ground plane (26) through a first through-hole (34). A second metallic strip (16) is affixed to the substrate (12) and is spaced apart from the first metallic strip (14) by a gap (28) and is electrically connected to the ground plane (26) through a second through-hole (38). A dielectric layer (20) overlies the substrate (12), the first metallic strip (14), and the second metallic strip (16). A third metallic strip (18) is affixed to the dielectric layer (20) and is disposed to overlie the gap (28). The third metallic strip (18) has a width less than the gap (28). The impedance of the distributed transmission line structure (10) is substantially constant over a predetermined range of thickness of the dielectric layer (20).
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申请公布号 |
US5805037(A) |
申请公布日期 |
1998.09.08 |
申请号 |
US19960780020 |
申请日期 |
1996.12.23 |
申请人 |
MOTOROLA CORPORATION |
发明人 |
FORSE, ROGER J.;OLSON, WILLIAM L. |
分类号 |
H01P3/08;H05K1/02;H05K3/46;(IPC1-7):H01P3/08 |
主分类号 |
H01P3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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