| 摘要 |
PROBLEM TO BE SOLVED: To secure the electrical connection even by feeble pushing force, by a method wherein a bump is provided on either one out of respective electrode pads of an IC chip or circuit substrate, etc., while multiple small holes penetrating an adhesive film inserted between the electrode pads so that the particles of conductive grains in contact with one another may be filled up between respective small holes. SOLUTION: Connecting pads 3a are formed on the positions corresponding to respective electrode pads 2b of a first IC chip 2 at least on one surface out of the upper side or under side on a second IC chip 3 bonded onto the first IC chip 2 so as to provide a bump 3b. At this time, multiple conductive grains 4a in the particle diameter almost equal to the thickness of an adhesive film 4 or larger than that are mixed in the adhesive film 4 in the density in contact with the bump 3b. In such a constitution, at least exceeding one out of the conductive grains 4a are held between respective bumps 3b of the second IC chip 3 and respective electrode pads 2b of the first IC chip 2, thereby enabling both elements to be electrically connected with one another without fail.
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