| 发明名称 |
Semiconductor apparatus, circuit board and combination thereof |
| 摘要 |
<p>A semiconductor apparatus (40) includes a first set of connection terminals (46) and a second set of connection terminals (48). One ends of the first and second sets of connection terminals (46 and 48) are connected to a semiconductor chip (41). The other ends of the first set of connection terminals (46) are connected onto a first connection plane (50) outside of a package (42). The other ends of the second set of connection terminals (48) are connected onto a second connection plane (52) outside of the package (42). <IMAGE></p> |
| 申请公布号 |
EP0862213(A2) |
申请公布日期 |
1998.09.02 |
| 申请号 |
EP19980103510 |
申请日期 |
1998.02.27 |
| 申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
KOBAYASHI, HARUFUMI |
| 分类号 |
H01L23/12;H01L23/31;H01L23/32;H01L23/495;H01L23/498;H01L23/50;H05K1/14;H05K1/18;(IPC1-7):H01L23/498 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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