| 发明名称 |
Semiconductor module with convex base plate |
| 摘要 |
<p>A semiconductor module includes a metal base plate having a plane upper surface and a convex lower surface. An electrically insulating and thermally conductive substrate is material-lockingly connected to the upper surface of the metal base plate. Semiconductor chips are material-lockingly connected to an upper surface of the substrate.</p> |
| 申请公布号 |
EP0654820(B1) |
申请公布日期 |
1998.09.02 |
| 申请号 |
EP19940117619 |
申请日期 |
1994.11.08 |
| 申请人 |
EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALBLEITER MBH & CO. KG |
发明人 |
KOEHLER, WERNER;SPANKE, REINHOLD, DIPL.-ING. |
| 分类号 |
H01L23/14;H01L23/13;H01L23/367;H01L23/40;H05K3/00;H05K3/34;(IPC1-7):H01L23/367;H01L25/04 |
主分类号 |
H01L23/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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