| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device by which a malfunction due to separately mounted noise-proofing parts can be eliminated, by allowing a substrate to be connected with a semiconductor chip to have a function to remove noises. SOLUTION: A substrate 4 is made of magnetic material with high specific resistance, so that noises can be surely removed from a signal inputted from a semiconductor chip 1 through the substrate 4 and a signal outputting from the semiconductor chip 1 through the substrate 4, when they are subjected to be inputted or outputted. Therefore, noise-proofing parts are unnecessary to be provided separately around a semiconductor device mounted conventionally to a mother board, and a space for mounting the noise-proofing parts becomes unnecessary on the mother board, contributing to high-density mounting, and no land for noise-proofing parts and no running line are needed, thus simplifying the wiring of mother board.</p> |
