发明名称 POWER SUPPLY DEVICE FOR SPUTTERING AND SPUTTERING DEVICE USING THE SAME
摘要 A power supply device for sputtering which enables improvement in step coverage and improvement in fineness of a sputtering film, by realizing stable sputtering at a voltage not higher than a starting voltage, thereby reducing scattering of sputtering particles due to collision with a sputtering inert gas. The power supply device for sputtering includes a DC power source for sputtering (A), a constant-current circuit (B) connected with the DC power source, a sputtering source (21) connected with the constant-current circuit (B), and a controller (11) for controlling a current outputted from the constant-current circuit (B) to be a constant current.
申请公布号 WO9837256(A1) 申请公布日期 1998.08.27
申请号 WO1998JP00692 申请日期 1998.02.19
申请人 SHIBAURA ENGINEERING WORKS CO., LTD.;KURIYAMA, NOBORU;YATSU, YUTAKA;UTSUNOMIYA, NOBUAKI;YASUMOTO, YUJI 发明人 KURIYAMA, NOBORU;YATSU, YUTAKA;UTSUNOMIYA, NOBUAKI;YASUMOTO, YUJI
分类号 H01J37/34;(IPC1-7):C23C14/34;C23C14/54;H01L21/203;H01L21/285 主分类号 H01J37/34
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