发明名称 |
POWER SUPPLY DEVICE FOR SPUTTERING AND SPUTTERING DEVICE USING THE SAME |
摘要 |
A power supply device for sputtering which enables improvement in step coverage and improvement in fineness of a sputtering film, by realizing stable sputtering at a voltage not higher than a starting voltage, thereby reducing scattering of sputtering particles due to collision with a sputtering inert gas. The power supply device for sputtering includes a DC power source for sputtering (A), a constant-current circuit (B) connected with the DC power source, a sputtering source (21) connected with the constant-current circuit (B), and a controller (11) for controlling a current outputted from the constant-current circuit (B) to be a constant current.
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申请公布号 |
WO9837256(A1) |
申请公布日期 |
1998.08.27 |
申请号 |
WO1998JP00692 |
申请日期 |
1998.02.19 |
申请人 |
SHIBAURA ENGINEERING WORKS CO., LTD.;KURIYAMA, NOBORU;YATSU, YUTAKA;UTSUNOMIYA, NOBUAKI;YASUMOTO, YUJI |
发明人 |
KURIYAMA, NOBORU;YATSU, YUTAKA;UTSUNOMIYA, NOBUAKI;YASUMOTO, YUJI |
分类号 |
H01J37/34;(IPC1-7):C23C14/34;C23C14/54;H01L21/203;H01L21/285 |
主分类号 |
H01J37/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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