The invention relates to semiconductor modules (1) comprising a metal support plate (2) a heat dissipator (8), at least one ceramic substrate (4) and several semiconductor elements (6). By introducing defined elastic points known as desired flexion points in the metal support plate (2) the mechanical tensions between the ceramic substrates and the metal support plate are substantially reduced during assembly on the cooling body. Transition heat resistance can thus be drastically reduced especially for convex shaped metal support plates without damaging the ceramic substrates during assembly.
