Drucksensor-Bauelement und Verfahren zur Herstellung

摘要

The invention relates to a pressure sensor component (1) comprising a chip carrier (3) with an approximately even surface (2) upon which a semiconductor chip (4) with an integrated pressure sensor having a pressure detection surface (4) exposed to a pressure to be measured (P) is arranged, in addition to an encapsulation (6) encompassing at least partially said semiconductor chip (4) and/or chip carrier (3) and made of electrically insulating material. A stacklike connector piece (10) is arranged or embedded in the component encapsulation. Said connector piece protrudes in relation to the pressure detection area (5) of the pressure sensor, passes through the encapsulation (6) and is connected to the pressure sensor. Its end (1) that rests on the semiconductor chip (4) also encompasses at least the pressure detection surface (5) in a pressure-tight manner. The opposite end (12) is open towards the outside. The invention also relates to a method for the production of one such pressure sensor component (1).