POLYPHENYLENE SULFIDE RESIN COMPOSITION AND RESIN-SEALED SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a compsn. which has a good moldability, is excellent in adhesion to other members, and gives a cured item with a high hardness by compounding a whisker (e.g. a titania whisker) or a compd. (e.g. an indene polymer) into a compsn. comprising a polyphenylene sulfide resin contg. a component having a specified non-Newtonian index and an inorg. filler having a specified particle size. SOLUTION: At least either a titania whisker or an aluminum borate whisker or a compd. selected from among an indene polymer, a phenol aralkyl resin, and a novolak phenol resin is compounded into a compsn. comprising a polyphenylene sulfide resin contg. a component having a non-Newtonian index of 1.1 or higher and an inorg. filler. The filler contains 5-40wt.% (based on the total filler) particles having an average particle size of 1μm or lower. This compsn. has a good storage stability and flame retardance, too.