发明名称 WIRE SAW DEVICE
摘要 PROBLEM TO BE SOLVED: To correctly supply slurry to a wire close to a work processing position even in the case where a processing position of a work by a wire is changed in a wire saw device, and change an opening of a slurry supply port in accordance with load fluctuation even in the case where processing load is fluctuated in processing the work. SOLUTION: A slurry supply mechanism 23 to supply slurry including free abrasive grain onto a wire 15 is provided with a supply direction changing device 56 to change a slurry supply direction in accordance with change of a work processing position by the wire 15. The slurry supply mechanism 23 is provided with an opening changing device 57 to change an opening of a slurry supply port 50 in accordance with load fluctuation in processing the work 15.
申请公布号 JPH10225857(A) 申请公布日期 1998.08.25
申请号 JP19970027937 申请日期 1997.02.12
申请人 NIPPEI TOYAMA CORP 发明人 TAKADA MICHIHIRO
分类号 B24B27/06;B28D5/00;B28D5/04;(IPC1-7):B24B27/06 主分类号 B24B27/06
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