| 摘要 |
PROBLEM TO BE SOLVED: To form a resist pattern having high resolving power, free from a recess in the top and having satisfactory adhesion to the substrate by using a photoresist compsn. contg. a specified alkali-soluble resin binder, a compd. that generates an acid when irradiated with active light, etc., and a solvent. SOLUTION: This photoresist compsn. contains a resin obtd. by substituting groups represented by the formula for 10-80% of the phenolic hydroxyl groups in an alkali-soluble resin, a compd. that generates an acid when irradiated with active light or radiation and a solvent. In the formula, R<1> is 1-4C alkyl, W is an org. residue contg. at least one of O, N, S, P and Si atoms, amino, ammonium or mercapto and (n) is a natural number of 1-4. The alkali-soluble resin is preferably poly(p-hydroxystyrene). |
