| 摘要 |
The invention concerns a substantially parallelepiped-shaped housing for electronic or optoelectronic components designed to receive one or several means for routing electric transmission signals in the form of multilayer ceramic (14, 16) and/or optical (11) elements between the outer part and the electronic components arranged inside. The housing comprises a bottom (3) and a rectangular annular frame (2) constituting walls (4, 6, 7, 8, 27, 28). The housing frame (2) is made of metal, with a continuous periphery, and is bored with one or several slots (9, 12, 13) in a substantially intermediate position in one or several of said side walls (4, 6, 7), or one or several notches (24, 26) arranged in overlapping position on one or several said side walls and on the bottom (23), and extending over the whole length of one edge of the housing. The housing is produced by different manufacturing methods.
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