| 摘要 |
PROBLEM TO BE SOLVED: To improve the mounting density of semiconductor chips on a circuit board, by arranging the connection pads of the semiconductor chip on one side of its top surface, and by providing the side surface of the semiconductor chip with external-connection-pad-parts to be connected with the connection pads of the semiconductor chip. SOLUTION: On one side of the top surface of a semiconductor chip 1, its connection pads 2 are arranged. Then, in order to enable the connection of the semiconductor chip 1 with the external, tips of external-connection-pad-parts 3 are connected with the connection pads 2, and the other ends thereof are provided on the side surface of the semiconductor chip 1 to obtain a semiconductor device 6. Subsequently, in order to mount the semiconductor device 6 on a circuit board, using a conductive bonding agent, etc., connection parts for connecting the semiconductor device 6 with the circuit board are bonded to the external-connection-pad-parts 3. In this way, the connection of the semiconductor chip 1 with the external are performed by using the external-connection- pad-parts 3 to make it possible to eliminate the working processes of the leads of dice-bonding and wire-bonding. |
