| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the number of the components of a semiconductor laser device by arranging a sub-mount on the main surface of a metallic platy member and a laser diode on the sub-mount so that the optical axis of the diode may become parallel to the main surface and sealing the sub-mount and diode with a transparent member. SOLUTION: An LD chip 1, a sub-mount 2, and a metallic frame 41 are prepared and the chip 1 is mounted on the main surface of the frame 41 through the sub-mount 2 so that the bottom face of the chip 1 may become parallel to the mounting surface of the frame 41. Then the frame 41 is placed in a metallic mold and the chip 1 and sub-mount 2 are sealed by forming a transparent molded resin 9 by injecting a resin into the mold and heating and curing the resin. Of the top and bottom parts of the mold, the parts corresponding to a laser light transmitting area 10 are formed in faces which are perpendicular to the main surface of the frame 41. Since no metallic block is required for attaching the LD chip 1 so that the chip 1 may emit laser light perpendicularly to the frame 41, the number of the components of a semiconductor laser device can be reduced.</p> |
