发明名称 |
Semiconductor wafer polishing apparatus with a flexible carrier plate |
摘要 |
<p>A carrier head for a semiconductor wafer polishing apparatus includes a rigid plate which has a major surface with a plurality of open fluid channels. A flexible wafer carrier membrane has a perforated wafer contact section for contacting the semiconductor wafer, and a bellows extending around the wafer contact section. A retaining ring is secured to the rigid plate with a flange on the bellows sandwiched between the plate's major surface and the retaining ring, thereby defining a cavity between the wafer carrier membrane and the rigid plate. A fluid conduit is coupled to the rigid plate allowing a source of a vacuum and a source of pressurized fluid alternately to be connected to the cavity. <IMAGE></p> |
申请公布号 |
EP0859399(A2) |
申请公布日期 |
1998.08.19 |
申请号 |
EP19980301043 |
申请日期 |
1998.02.12 |
申请人 |
INTEGRATED PROCESS EQUIPMENT CORP. |
发明人 |
BARNS, CHRIS E.;CHARIF, MALEK;LEFTON, KENNETH D.;MITCHEL, FRED E. |
分类号 |
H01L21/683;B24B37/30;B24B37/32;H01L21/304;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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