IMAGING DEVICE FOR ENDOSCOPE

摘要

PROBLEM TO BE SOLVED: To thin thickness of an imaging element assembly to reduce a diameter of a device, and reduce cost by utilizing an imaging element product obtained in a TAB(tape automated bonding) method. SOLUTION: A conductor lead (inner lead of a TAB product) 21 is formed on a terminal G of a CCD 20 to be protruded from an outer circumference of an imaging element 18 in a TAB method in which mass production is possible, and a cover glass 22 is installed in such a way that an air gap in an air tight condition is formed to the image surface side of the CCD 20, so the image pickup element is formed. As the imaging element 18 is disposed on an aperture hole 24A in a circuit board 24, the conductor lead 21 is connected to a terminal H of the circuit board 24. Need of using a box-shaped package is thus eliminated.