| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting method in which the thickness of a wafer to be cut out becomes uniform as far as practicable when a work is cut by a wire saw. SOLUTION: A work cutting method pressure-contacts a work, at a specified speed, against a wire which moves from a wire delivery side to a wire receiving side and, while feeding abrasive grain slurry to a pressure-contact part, cut out the work for production of wafers. In this case, the feed speed of the work is controlled according to the abrasive grain size of the abrasive slurry so as to offset a reduction in cutting tolerance due to a reduction in abrasive grain size which occurs during the cutting of the work by an increase in cutting tolerance due to a reduction in the feed speed of the work. |
