| 摘要 |
PROBLEM TO BE SOLVED: To improve both removal performances of a ceramic layer for restraint after baking under pressure and flatness of baked substrate. SOLUTION: Baking under pressure is carried out by setting hardness of a ceramic material of a ceramic green sheet 12 for restraint (ceramic for restraint for short) to be applied to both sides of a low-temperature baked ceramic substrate 11 before baking equal to or lower than that of the low- temperature baked ceramic substrate 11. The hardness of a projection material to be used in the following blast treatment is set to a hardness equal to or higher than that of the ceramic for restraint and equal to or lower than that of the low-temperature baked ceramic substrate 11 to remove the ceramic for restrain on the surface of a baked substrate by blast treatment. Consequently, the ceramic for restraint can be efficiently removed after baking under pressure and shaving off of the substrate surface by the projection material is prevented to improve flatness of the surface of the substrate. |
