发明名称 Method for making copper electrical connections
摘要 A method for making electrical connections between a lead and a conductor on a substrate, the method including the steps of disposing a copper conductor on a ceramic substrate; positioning a lead in contact with the conductor; applying a copper film to the lead and the conductor to attach the lead to the conductor; and heating the substrate, lead and conductor assembly to secure bond the lead and conductor together. In a preferred embodiment, the conductor, lead and film are made of copper. The method can further include disposing a resistive film of the substrate using thin or thick film processes.
申请公布号 US5794327(A) 申请公布日期 1998.08.18
申请号 US19960611220 申请日期 1996.03.05
申请人 BIRD ELECTRONIC CORPORATION 发明人 WHISLER, RICHARD E.;WYSONG, LARRY LEE
分类号 H01L21/48;H05K1/09;H05K1/16;H05K3/24;H05K3/32;(IPC1-7):H01C17/06;H01R9/00 主分类号 H01L21/48
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