发明名称 |
Method for making copper electrical connections |
摘要 |
A method for making electrical connections between a lead and a conductor on a substrate, the method including the steps of disposing a copper conductor on a ceramic substrate; positioning a lead in contact with the conductor; applying a copper film to the lead and the conductor to attach the lead to the conductor; and heating the substrate, lead and conductor assembly to secure bond the lead and conductor together. In a preferred embodiment, the conductor, lead and film are made of copper. The method can further include disposing a resistive film of the substrate using thin or thick film processes.
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申请公布号 |
US5794327(A) |
申请公布日期 |
1998.08.18 |
申请号 |
US19960611220 |
申请日期 |
1996.03.05 |
申请人 |
BIRD ELECTRONIC CORPORATION |
发明人 |
WHISLER, RICHARD E.;WYSONG, LARRY LEE |
分类号 |
H01L21/48;H05K1/09;H05K1/16;H05K3/24;H05K3/32;(IPC1-7):H01C17/06;H01R9/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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