发明名称 METHOD FOR LAMINATING RESIN FILM WITH SMALL ENGULFED BUBBLES OF ONE SURFACE
摘要 PROBLEM TO BE SOLVED: To provide a method for laminating a resin film with small engulfed bubbles of one surface. SOLUTION: The method for laminating resin film with small engulfed bubbles of one surface comprises the steps of thermally press bonding a resin film 2 to one surface of a feeding metal strip 1 at a temperature of melting starting temperature of the film to lower than a heat absorbing peak temperature of melting, then heating the strip 1 thermally press bonded with the film 2 to the heat absorbing peak temperature or higher of melting of the film, thereafter supplying the film 2 to the other surface of the strip 1, and thermally press bonding the film to both the surfaces of the strip. According to this method, bubble engulfing of the thermally press bonded surface can be reduced in the case of high speed laminating.
申请公布号 JPH10217392(A) 申请公布日期 1998.08.18
申请号 JP19970025017 申请日期 1997.02.07
申请人 NIPPON STEEL CORP 发明人 DATE HIROMITSU;GOTO YASUTO;OGA TOMOYA
分类号 B32B15/08;B29C63/02;B29C65/20;B29K105/22;B29L9/00;(IPC1-7):B32B15/08 主分类号 B32B15/08
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