| 摘要 |
An array of conductors (14) is first etched onto a deposited layer and the free ends of each sector are fixed by ILB to terminals of the IC (11) directly by, for example, thermal compression or ultrasound or indirectly by solder balls or similar which raise up the input-output terminals of the IC. A force is used to separate the conductors from a passifying layer (20) and an insulating resin (21) is then deposited on each conductor or on a group or all conductors or all or part of the surface of the IC. Alternatively, an insulating spacer is fixed under the conductor outside the area of the IC. |
