| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device capable of accurately judging the acceptance or rejection (presence or absence of solder bridge) of the soldering condition of even extremely high density and small pitch parts. SOLUTION: The multiple leads of an electronic part 3 are formed so that X-ray 2 is irradiated on a printed circuit board 4 in which each of the leads is soldered on a land, a specified distribution width of transmission amount is calculated from the maximum value of the distribution data on transmission amount and the minimum value before and after the maximum value and, when the distribution width of the transmission amount is above a specified limit, it is judged that a solder bridge is present. Also the scanning of X-ray irradiating position is started from near a given land, and the scanning is continued as long as the distribution data on the transmission amount at a level of over a specified threshold set at a level capable of detecting a clear solder bridge only is detected continuously and, when the scanning reaches the adjacent land, it is judged that the solder bridge is present between the leads. |
