| 摘要 |
PROBLEM TO BE SOLVED: To obtain a light-emitting diode whose production process does not require a mold, is simplified and whose costs can be lowered, by a method wherein a transparent sealing material is injected into a space which is formed between a groove-shaped part and a fluorescent film. SOLUTION: In a manufacturing method for a light-emitting diode 1, a groove-shaped part 3 in which a plurality of chip-mount recessed parts 3a are continuously arranged is formed on a three-dimensional molded substrate 2, light-emitting diode(LED) chips 4 are mounted on, and wired to, the respective chip-mounting recessed parts 3a in the groove-shaped part 3, the groove-shaped recessed part 3 is then lidded with a thin sheetlike fluorescent film 5, a transparent sealing material 6 is injected into a space which is formed between the groove-shaped part 3 and the fluorescent film 5 so as to be hardened, and the LED chips 4 are cut and separated. In the manufacturing method, since the transparent sealing material is injected into the space formed between the groove-shaped part 3 and the fluorescent film 5, a mold is not required in a production process. |
