发明名称 MARKING METHOD FOR OBJECT TO BE WORKED
摘要 <p>PROBLEM TO BE SOLVED: To restrain the generation of dust due to evaporation of a molten member and to obtain the mark having excellent visibility by heating the background part around a pattern marking part at the lower temperature than the temperature reaching when a pulse laser beam transmitted a pattern mask is irradiated. SOLUTION: The laser beam oscillating command to Nb:YAG laser oscillator 1 (pulse laser oscillator) from a controller 10 and a pattern displaying signal from a liquid mask controller 11 are sent. The laser beam 2 of a linear polarized light having about uniform intensity distribution is emitted from the pulse laser beam oscillator 1. The laser beam 2 is made incident on a liquid crystal mask 4 via a magnifying optical system 3. The laser beam 2' transmitted the liquid crystal mask 4 is irradiated on a Si water to mark the pattern 9A after being separated with a beam splitter 6. The laser beam is irradiated under the state heating the Si wafer, whereby energy poured into the pattern marking part 9A is restrained to diffuse into the background part 9B, and moreover the generation of dust due to partial evaporation is prevented.</p>
申请公布号 JPH10211593(A) 申请公布日期 1998.08.11
申请号 JP19970015020 申请日期 1997.01.29
申请人 HITACHI LTD 发明人 KUWABARA KOJI;SASAKI HIROHARU;YOSHIKAWA TOSHIMITSU
分类号 H01L21/02;B23K26/00;B23K26/06;B23K101/40;(IPC1-7):B23K26/00 主分类号 H01L21/02
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