发明名称 Gas distribution for CVD systems
摘要 A substrate processing system including a vacuum chamber; a pedestal which holds a substrate during processing; and a gas distribution structure which during processing is located adjacent to and distributes a process gas onto a surface of the substrate that is held on the pedestal for processing. The gas distribution structure includes a gas distribution faceplate including a plurality of gas distribution holes formed therethrough, wherein the holes of at least a first set of the plurality of holes pass through the faceplate at angles other than perpendicular to the surface of substrate.
申请公布号 US5792269(A) 申请公布日期 1998.08.11
申请号 US19950550668 申请日期 1995.10.31
申请人 APPLIED MATERIALS, INC. 发明人 DEACON, THOMAS E.;CHEUNG, DAVID;LEE, PETER WAI-MAN;HUANG, JUDY H.
分类号 C23C16/44;C23C16/455;(IPC1-7):C23C16/00 主分类号 C23C16/44
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