| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can suppress an increase in footprint and improve a throughput while maintaining processing uniformity in a chemical solution processor. SOLUTION: Two substrate transfer robots TC and TH are located at different height positions in a single transportation path of a substrate processing apparatus. In performing circuit transportation of substrate, the substrate transfer robot TC accesses spin coaters (chemical solution processors) SC1, SC3 and cool plates (cooling processors) CP1 to CP4. The substrate transfer robot TH, on the other hand, accesses hot plates (heating processes) HP1 to HP6 and the cool plates CP1 to CP4. Since substrate transfer between the both substrate transfer robots is carried out through the cooling processors, processing uniformity can be secured without the need for the heated substrate transfer robots to access the chemical solution processors. |
