| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition excellent in mold release characteristics and coating performances and slight in mold stain, by adding a specific ketone compound to a resin component consisting of a polyamide resin and a thermoplastic resin except the polyamide resin. SOLUTION: This polyamide resin composition is obtained by compounding (A) 100 pts.wt. of a resin component composed of (i) 100-20wt.% of a polyamide resin such as a polyamide resin prepared from xylenediamine and anα,ω- straight-chain aliphatic dibasic acid or a mixed resin of the polyamide resin and nylon 66 and/or nylon 6 and (ii) 0-80wt.% of a thermoplastic resin (e.g. polyphenylene ether resin) except the component (i) and (iii) optionally an inorganic or organic fibrous packing substance, filter, stabilizer, ultraviolet absorber, dye, pigment, etc., with (B) 0.1-5 pts.wt. of a ketone compound of the formula (R<1> and R<2> are each a 5-34C hydrocarbon).
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