SUBSTRATE FOR CHIP PACKAGE,申请号JP19970326496-传众专利搜索

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发明名称	SUBSTRATE FOR CHIP PACKAGE
摘要
申请公布号	JPH10212132(A)	申请公布日期	1998.08.11
申请号	JP19970326496	申请日期	1997.11.27
申请人	HOYA CORP	发明人	HACHITANI YOICHI
分类号	C03C3/076;C03C10/00;(IPC1-7):C03C3/076	主分类号	C03C3/076
代理机构		代理人
主权项
地址

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