发明名称 Method of manufacturing a semiconductor device whereby photomasks comprising partial patterns are projected onto a photoresist layer so as to merge into one another
摘要 A method of manufacturing a semiconductor device whereby a photoresist layer is provided on a surface of a slice of semiconductor material, after which two photomasks corresponding to adjoining portions of a pattern to be formed in the photoresist are projected on the photoresist by means of a projection lens, with overlapping edges. Strip-shaped transparent end portions of the two photomasks which are situated within this edge and which overlap one another in projection are provided with strip-shaped connection patterns which overlap one another in projection and which exhibit a complementary transmittance in projection. To keep the quantity of computer data necessary for describing the photomasks comparatively small, the strip-shaped transparent end portions of the two photomasks overlapping one another in projection are provided at their edges only with strip-shaped connection patterns overlapping one another in projection.
申请公布号 US5792591(A) 申请公布日期 1998.08.11
申请号 US19960774854 申请日期 1996.12.27
申请人 U.S. PHILIPS CORPORATION 发明人 THEUWISSEN, ALBERT J.P.
分类号 G03F1/14;G03F7/20;(IPC1-7):G03F7/20 主分类号 G03F1/14
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