发明名称 CHIP TYPE AND PRODUCTION THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To constitute a voltage divider circuit using a single chip. SOLUTION: A pair of electrodes 2a, 2b are formed on the opposite end sides on the surface and rear of a chip substrate 1 and a pair of electrodes 4a, 4b for a voltage divider circuit are formed separately between them. The opposite electrodes 2a, 2b on the surface of the chip substrate 1 are then bridged and a film resistor 3 is formed traversing the electrode 4a for the voltage divider circuit on the surface of the chip substrate 1. Subsequently, a side electrode 2c connecting the surface and rear electrodes 2a, 2b and an electrode for the side voltage divider circuit connecting the surface and rear electrodes 4a, 4b for the voltage divider circuit are formed on the side face of the chip substrate 1.</p>
申请公布号 JPH10208901(A) 申请公布日期 1998.08.07
申请号 JP19970008899 申请日期 1997.01.21
申请人 ROHM CO LTD 发明人 ONO SEIYA
分类号 H01C1/142;H01C7/00;H01C13/02;H01C17/06;H01C17/30;(IPC1-7):H01C7/00 主分类号 H01C1/142
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