发明名称 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN THEREFROM, ELECTRONIC DEVICES PRODUCED BY USING THE SAME, AND METHOD FOR PRODUCTION THEREOF
摘要 <p>A photosensitive composition comprising a polyimide precursor, a photosensitive substance having a structure represented by general formula (1) (wherein A1 represents an atom of the group VI in the periodic table) in its molecule, and/or a photosensitive substance having a structure represented by general formula (2) (wherein A2 represents an O, S or N atom) in its molecule, appropriate for forming a positive pattern with an excellent heat resistance, and applicable in electronic devices.</p>
申请公布号 WO1998034159(P1) 申请公布日期 1998.08.06
申请号 JP1998000348 申请日期 1998.01.28
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