| 发明名称 |
Method of manufacturing semiconductor devices |
| 摘要 |
<p>A method of manufacturing a semiconductor device for forming with high accuracy a marker used for separating a semiconductor device 10, wherein a plurality of semiconductor devices 10 are fabricated in a semiconductor substrate 16 are separated, and wherein etched grooves 31 are formed outside the semiconductor regions in the semiconductor substrate 16. <IMAGE></p> |
| 申请公布号 |
EP0856923(A2) |
申请公布日期 |
1998.08.05 |
| 申请号 |
EP19980101486 |
申请日期 |
1998.01.28 |
| 申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
GOTOH, OSAMU;YAMADA, KOHJI;YAEGASHI, HIROKI;HORIKAWA, HIDEAKI |
| 分类号 |
H01L21/308;H01L21/78;H01S5/00;H01S5/02;H01S5/16;(IPC1-7):H01S3/025;B28D5/00 |
主分类号 |
H01L21/308 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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