| 摘要 |
PROBLEM TO BE SOLVED: To save polishing fluid and supply polishing fluid uniformly to the whole in-plane range of an object to be polished by spraying polishing fluid over the polishing surface of the object to be polished. SOLUTION: A semiconductor wafer 20 is fitted onto a wafer holding panel 30 with a surface subjected to be polishing directed downwards. A wafer lifting and rotating device is operated to press the semiconductor wafer 20 against a polishing pad 24 at prescribed polishing pressing force and rotate the semiconductor wafer 20. The polishing fluid is fed to a nozzle 12 from a tank 16 by a pump 14, and the foggy polishing fluid is sprayed over the polishing pad 24 from a nozzle 12. The polishing pad 24 rotates in the arrow (a) direction, thus it is possible to spray the polishing fluid over the whole surface range coming into contact with the semiconductor wafer 20 of the polishing pad 24. |
