发明名称 SEMICONDUCTOR DEVICE CARD
摘要 PROBLEM TO BE SOLVED: To provide a structure for allowing the improvement of connection strength by employing ultrasonic wave connection and, on the other hand, allowing the further improvement of connections strength while decreasing the number of parts. SOLUTION: The card is of the type where a printed circuit board 1 with electric parts fabricated in the inside thereof is housed, and a pair of metal plates 5 forming front and rear surfaces of the card and a pair of opposite resin frames 6 firmed surrounding the periphery of each metal plate 5 for forming a card surface frame are connected in a manner allowing the peripheral bent portions of the metal plates 5 to be embedded in the resin frame 6; in addition, the pair of the opposite side surface frames have welding projections13 and recess grooves 14 for receiving them in order that at least the distal ends of the projections are melted and welded in the recess parts. Also, while a plurality of projections 10a are projected downward from one bent portion the pair of the metal plates 5, engagement portions 11, 12 are formed to be engaged with the projections 10a on the bent portion of the other metal plate 5, so that the pair of the metal plates 5 are communicated with each other through engagement of the projections 10a and engagement portions 11, 12, and the bonding of the side surface frames are reinforced.
申请公布号 JPH10203062(A) 申请公布日期 1998.08.04
申请号 JP19970010033 申请日期 1997.01.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 ONODA SHIGEO;MORII TOMOMI
分类号 B42D15/10;G06K19/077;H05K5/02 主分类号 B42D15/10
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