发明名称 METHOD AND DEVICE FOR PRODUCING THIN FILM
摘要 PROBLEM TO BE SOLVED: To efficiently produce a thin film in which minute structure control of a high degree is held without causing thermal decomposition of a material for forming the thin film and adhesive strength to a substrate is high without receiving effect of a pollutive substance and durability is high and a function is enhanced. SOLUTION: The surface of a substrate 30 is cleaned and treated in a closed clean vessel 8 free from floating dust and/or pollutive gas. The substrate 30 is placed in a vacuum vessel 3 without being taken out in the atmosphere. Thin film forming material of a liquid state containing composition incorporating a thermoplastic polymer compound is accumulated on the substrate 30 by atomizing the thin film forming material into the vacuum vessel 3 from the atomization nozzles of atomization devices 33 provided at every kind of the above- mentioned thin film forming material. Thereafter, the substrate 30 is transferred into a vacuum vessel 9 and both heating treatment and pressure molding treatment of the thin film forming material accumulated on the substrate are performed. In the meantime, the temperature of the substrate is held in a temperature range which exceeds the melt starting temperature of composition containing the thermoplastic polymer compound and does not exceed the thermal decomposition starting temperature thereof. Furthermore, sealing treatment is performed in the closed vessel 8 without being exposed to the atmosphere.
申请公布号 JPH10202153(A) 申请公布日期 1998.08.04
申请号 JP19970007419 申请日期 1997.01.20
申请人 AGENCY OF IND SCIENCE & TECHNOL;DAINICHISEIKA COLOR & CHEM MFG CO LTD;HIRAGA TAKASHI;MORIYA TETSUO 发明人 HIRAGA TAKASHI;MORIYA TETSUO;TANAKA NORIO;YANAGIMOTO HIROMITSU
分类号 B05D3/00;B01J19/00;B05B7/24;B05B12/10;B05D1/02;B05D7/24;B29C41/08;B29C41/50;C08J5/18;C23C4/12;C23C26/00;H01L51/50;H05B33/10 主分类号 B05D3/00
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