| 摘要 |
PROBLEM TO BE SOLVED: To reduce a use amt. of a resin material to a large extent when an electronic part is produced by molding a thermosetting resin and to obtain good moldability. SOLUTION: In a plastic molding apparatus wherein a plurality of cavities 6, 7 are provided to upper and lower molds 3, 4 and a thermosetting resin 8 is melted within the pot formed to the upper mold 3 or the lower mold 4 and allowed to flow under pressure by a plunger 2 to be pushed in cavities to be molded, the head part of the plunger 2 is made conical and a plurality of cavities 6, 7 are uniformly filled with a molten thermosetting resin 8a. |
