| 摘要 |
PROBLEM TO BE SOLVED: To form a noncontact type IC card that can prevent the occurrence of warpage with all possible manners in an IC card having a module package buried in the card main body. SOLUTION: This card is composed of a center sheet 3 with a module hole 3a made therein, a pair of heat weldable cover sheets 4a, 4b formed by being connected on both the surfaces of the center sheet 3 and of the same thickness and material, and a module package 10 sealed in the module hole 3a of the center sheet 3 with the cover sheets 4a, 4b and having electric parts such as antenna coils sealed with resin and formed into a flat coil in its both surfaces. |
