发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor device includes a semiconductor chip, an I/O-cell circuit having a transistor-array part. The semiconductor device further includes a first group of bonding pads and a second group of bonding pads. The first group of bonding pads is connected with the I/O-cell circuit and is formed in a first pad-forming area arranged along an outer side of the transistor-array part in the I/O-cell circuit. And the second group of bonding pads is connected with the I/O-cell circuit and is formed in a second pad-forming area along an inner side of the transistor-array part in the I/O-cell circuit.
申请公布号 KR0147920(B1) 申请公布日期 1998.08.01
申请号 KR19950003517 申请日期 1995.02.23
申请人 FUJITSU LTD. 发明人 KUNIYUKI, HAYASHI;KITAGAWA, MASAYA;TANIZAWA, TETSU
分类号 H01L21/822;H01L23/528;H01L27/04 主分类号 H01L21/822
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