发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device includes a semiconductor chip, an I/O-cell circuit having a transistor-array part. The semiconductor device further includes a first group of bonding pads and a second group of bonding pads. The first group of bonding pads is connected with the I/O-cell circuit and is formed in a first pad-forming area arranged along an outer side of the transistor-array part in the I/O-cell circuit. And the second group of bonding pads is connected with the I/O-cell circuit and is formed in a second pad-forming area along an inner side of the transistor-array part in the I/O-cell circuit. |
申请公布号 |
KR0147920(B1) |
申请公布日期 |
1998.08.01 |
申请号 |
KR19950003517 |
申请日期 |
1995.02.23 |
申请人 |
FUJITSU LTD. |
发明人 |
KUNIYUKI, HAYASHI;KITAGAWA, MASAYA;TANIZAWA, TETSU |
分类号 |
H01L21/822;H01L23/528;H01L27/04 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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