| 摘要 |
PROBLEM TO BE SOLVED: To form a wiring pattern of an elector-plating metal film of film thickness of superior uniformity from the peripheral part to the center part of a substrate in the manufacture of a wiring board. SOLUTION: A PdP film is formed on a non-roughened glass substrate by electroless plating, to pattern the PdP film, and then a metal film is formed on the PdP film by electro-plating, to form a wiring pattern. The peripheral part of the PdP film after pattening is covered with such a metal film as an Ag joil or an Al foil, and volume resistivity is made 3×10<-6>Ωcm or below, and a feeder terminal for electro-plating is pressed onto the metal film to perform the electro-platening. Alternatively, the peripheral part of the PdP film after patterning is covered with such a metal plating layer as an Ag plating layer or a Cu plating layer, and volume resistivity is made 3×10<-6>Ωcm or below, and the feeder terminal for electro-plating is pressed onto the metal plating layer to conduct the electro-plating.
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