发明名称 |
Process for manufacturing a composite arrangement |
摘要 |
The bonding method allows at least one printed circuit substrate (10) to be bonded to a carrier (40) via an intermediate material layer (30), which is previously impregnated with a resin (prepreg), upon application of pressure via a pressure stamp. The applied pressure is at least partially reduced in the vicinity of an opening (11) in the printed circuit substrate. The carrier may have a recess (42) in its surface underlying the opening in the printed circuit substrate and the pressure stamp may have a cut-out section aligned with the opening. |
申请公布号 |
EP0792092(A3) |
申请公布日期 |
1998.07.29 |
申请号 |
EP19960117583 |
申请日期 |
1996.11.02 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
WAGENBRENNER, WALTER;WIESA, THOMAS;SCHIMITZEK, RALPH |
分类号 |
H05K3/00;H05K3/34 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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