| 摘要 |
<p>The contact-laminated carrier element (1) is pressed with the bonded-on IC module (12) into a moulding chamber (31) of a moulding apparatus (3), filled with two-component epoxy resin, and is left at an elevated temperature to cure. Excess epoxy resin is taken up in excess chambers (31A) of the moulding apparatus (3) and a thin epoxy layer (20) forms on the carrier element (1) and produces good adhesion when the carrier element (1) is bonded with an ID card. Advantageous mould designs and use of the carrier element (1) with the epoxy-sheathed IC module (12) in an ID card are presented. <IMAGE></p> |
