| 摘要 |
A frame for supporting a printed circuit board during manufacturing operations having a frame with at least one open area and frame holes arrayed around an edge of open area; a flat finger for each frame hole and having a mounting hole located in the middle of the finger; a stool for each finger having a stem and a cap on one end and a helical spring biasing the finger toward the frame. The stem passes through the mounting hole of the respective finger and frame hole. Each stem has a retaining member on an end of the stool distal from the cap such that each stool is retained in its respective hole by the cap against the finger on one end and the retaining means against the frame on the other side of the finger and frame so that each finger is rotatably mounted on the frame. A helical spring on the stem in the frame hole biases the finger toward the frame so that, when the finger is oriented in a first direction with a long dimension of the finger perpendicular to an edge of the open area, a printed circuit board may be secured against the frame by fingers pressing the printed circuit board against the frame with an area of the printed circuit board exposable to heat for solder reflow. The printed circuit board is released from the frame when the finger is rotated about the stem to an orientation parallel to the edge of the area.
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