发明名称 RESIN COMPOSITION IMPROVED IN WELD LINE DIELECTRIC STRENGTH
摘要 PROBLEM TO BE SOLVED: To obtain a composition which can give injection moldings improved in weld line dielectric strength without detriment to heat resistance and dimensional stability by mixing a resin composition reinforced with glass fibers and/or talc and/or mica with a specified amount of a polytetrafluoroethylene powder having a specified particle diameter. SOLUTION: A resin composition (e.g. PP) reinforced with 20-60wt.% glass fibers and/or talc and/or mica is mixed with 0.5-10wt.% polytetrafluoroethylene powder having a particle diameter of 2-20μm. The glass fibers with which the PP resin is reinforced are desirably ones having a fiber length of 0.2-3mm, desirably 0.4-2mm (in terms of the length of the remaining fibers in a molding), a diameter of 6-23μ, desirably 9-17μm. The talc is desirably one having a mean particle diameter of 1-20μm, desirably 5-12μm. The mica is desirably one having a mean particle diameter of 5-50μm, desirably 7-30μm.
申请公布号 JPH10195304(A) 申请公布日期 1998.07.28
申请号 JP19970013066 申请日期 1997.01.08
申请人 CHISSO CORP 发明人 ATSUMI NOBUKAZU
分类号 C08K3/34;C08K7/14;C08L23/10;C08L101/00;(IPC1-7):C08L101/00 主分类号 C08K3/34
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