Temperature supervision circuit arrangement for electronic component

摘要

The circuit arrangement detects an overstepping of a critical temperature of a component (HLB) by use of at least one sensing transistor (T1) which comprises a temperature-dependent current-voltage characteristic, and is thermally connected with the component, and a current source (SQ) connected in series with the sensing transistor. A circuit arrangement for the compensation of the parasitic leak currents (ICB1, ICS1) is provided at the sensing transistor. The component (HLB) is preferably a semiconductor component, and the sensing transistor is a bipolar transistor.