| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a lead frame for semiconductor device with stable bend shape precision, capable of relieving the impact force during in a tie bar cutting time. SOLUTION: This lead frame for semiconductor device is provided with a tie pad 1, outer leads 2 connecting to a semiconductor element by bonding wire, a tie bar 3 intermediately supporting the outer leads 2, slits 6 formed on the tie bar 3 and a frame 4 supporting the outer leas 2 on the ends. The slits 6 are formed within the width of the outer leads 2. On the other hand, for the shape of the slits 6 includes a polygon, an elipse and a circle. |
